
Bare PCB
Layer count |
1 ~ 64layers |
|
|
Laminates type | FR-4(High Tg, Halogen Free, High Frequency) FR-5, CEM-3, PTFE, BT, Getek, Aluminium base,Copper base,KB, Nanya, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon | ||
Board thickness | 6-240mil | ||
Max Base copper weight | 210um (6oz) for inner layer 210um (6oz) for outer layer | ||
Min mechanical drill size | 0.2mm (0.008") | ||
Aspect ratio | 12 : 1 | ||
Max panel size | Sigle side or double sides:500mm*1200mm, Multilayer layers:508mm X 610mm (20" X 24") | ||
Min line width/space | 0.076mm / 0.0.076mm (0.003" / 0.003") | ||
Via hole type | Blind / Burried / Plugged(VOP,VIP…) | ||
HDI / Microvia | YES | ||
Surface finish | HASL Lead Free HASL Immersion Gold (ENIG), Immersion Tin, Immersion Silver Organic Solderability Preservative (OSP) / ENTEK Flash Gold(Hard Gold plating) ENEPIG Selective Gold Plating, Gold thickness up to 3um(120u") Gold Finger, Carbon Print, Peelable S/M | ||
Solder mask color | Green, Blue, White, Black, Clear, etc. | ||
Impedance | Single trace,differential , coplanar impedance controlled ±10% | ||
Outline finish type | CNC Routing; V-Scoring / Cut; Punch | ||
Tolerances | Min Hole tolerance (NPTH) Min Hole tolerance (PTH) Min Pattern tolerance | ±0.05mm ±0.075mm ±0.05mm | |
Sort | Item | Normal capability | Specific capability | |
Layer count |
Rigid-flex PCB |
2 ~14 |
2 ~24 |
|
Flex PCB | 1 ~10 | 1 ~12 | ||
Board | Min. Thickness | 0.08 +/- 0.03mm | 0.05 +/- 0.03mm | |
Max. Thickness | 6mm | 8mm | ||
Max. Size | 485mm * 1000mm | 485mm * 1500mm | ||
Hole & Slot | Min.Hole | 0.15mm | 0.05mm | |
Min.Slot Hole | 0.6mm | 0.5mm | ||
Aspect Ratio | 10 : 1 | 12 : 1 | ||
Trace | Min.Width / Space | 0.05 / 0.05mm | 0.025 / 0.025mm | |
Tolerance |
Trace W / S |
± 0.03mm |
± 0.02mm |
|
Hole to hole | ± 0.075mm | ± 0.05mm | ||
Hole Dimension | ± 0.075mm | ± 0.05mm | ||
Impedance | 0 ≤ Value ≤ 50Ω : ± 5Ω 50Ω ≤ Value : ± 10%Ω | |||
Material | Basefilm Specification | PI : 3mil 2mil 1mil 0.8mil 0.5mil | ||
ED&RA Cu : 2OZ 1OZ 1 / 2OZ 1 / 3OZ 1 / 4OZ | ||||
Basefilm Main supplier | Shengyi / Taiflex / Dupont / Doosan / Thinflex | |||
Coverlay Specification | PI : 2mil 1mil 0.5mil | |||
LPI Color | Green / Yellow / White / Black / Blue / Red | |||
PI Stiffener | T : 25um ~250um | |||
FR4 Stiffener | T : 100um ~2000um | |||
SUS Stiffener | T : 100um ~400um | |||
AL Stiffener | T : 100um ~1600um | |||
Tape | 3M / Tesa / Nitto | |||
EMI shielding | Silver film / Copper / Silver ink | |||
Surface finish | OSP | 0.1 - 0.3um | ||
HASL | Sn : 5um - 40um | |||
HASL(Leed free) | Sn : 5um - 40um | |||
ENEPIG |
Ni : 1.0 - 6.0um |
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Plating hard gold |
Ni : 1.0 - 6.0um |
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Flash gold |
Ni : 1.0 - 6.0um |
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ENIG |
Ni : 1.0 - 6.0um |
|||
Immesion silver | Ag : 0.1 - 0.3um | |||
Plating Tin | Sn : 5um - 35um | |||
SMT | Type | 0.3mm pitch Connectors | ||
0.4mm pitch BGA / QFP / QFN | ||||
0201 Component |
PACKING&SHIPPING
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Auto material cutting machine, cut sheet size 37*49inch, 41*49inch, 43*49inch to working PNL size.
Check point:
1.Base Material Type
2.Dimension
3.No Dent、No Scratch
4.Quantity -
After development, the non-product copper is etched away.
Check point:
1.Temperature
2.Speed、Pressure
3.Concentration
4.Line width/space -
After development, the non-product copper is etched away.
Check point:
1.Temperature
2.Speed、Pressure
3.Concentration
4.Line width/space -
AOI(Automatic Optic Inspection)
Check point:
1.Open/short
2.Copper Residue -
Horizontal black oxidation
Check point:
1.Concentration
2.Temperature
3.Coating Thinkness -
Mechanical drilling
Check point:
1.Hole Size
2.Hole Wall Roughness
3.Registration
4.The amount of holes
5.Appearance -
Plate through holes
Check point:
1.Temperature
2.Concentration
3.Plating Rate -
Spry coating line
Check point:
1.No Exposure copper
2.No Mask on Pad
3.No Scratch, Scum -
The non-product copper is etched away.
Check point:
1.Temperature
2.Speed
3.Pressure
3.Concentration
4.Line width/space -
Pattern plating
Check point:
1.Temperature
2.Concentration
3.Current Density
4.Check scratching the tin on the lines -
The non-product copper is etched away.
Check point:
1.Temperature
2.Speed
3.Pressure
3.Concentration
4.Line width/space -
AOI(Automatic Optic Inspection)
Check point:
1.Open/short
2.Copper Residue -
Spry coating line
Check point:
1.No Exposure copper
2.No Mask on Pad
3.No Scratch, Scum -
Auto-printing
Check point:
1.correct CAM data
2.Registration
3.Definition
4.No scratching -
Immersion Gold
Check point:
1.Temperature
2.Concentration
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CNC routing for finish board size
Check point:
1.Dimension
2.No Powder Residue
3.No Scratch -
Flying probe tester
Check point:
1.Open
2.Short
3.Circumferential Separation -
Fanal quality control, visual inspection
Check point:
1.Scratching
2.Crease 3.Oxidation
4.Solder deviation
5.Drill deviation
6.Conductor nick
7.Copper residue and so on -
SIR Oven
Surface insulation resistance testingThermal cycling chamber
Thermal cycling testing3D Dimension
X-ray measuring instrument Measuing gold thickness, nickel thickenss, solder thickness and so on
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Coil material cutting piece material
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Graphic transfer
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Graphic transfer
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Automated Optical Inspection
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Paste insulation protective film
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To increases the joint force between each layer for mulitlayer
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Stack up each layer for multilayer
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By high temperature and high pressure makes each layer get together
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Drill hole for basefilm/stiffener/coverlay
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Desmear process
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Ensure the conduction of each layer
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Graphic transfer
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Graphic transfer
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Punch tooling-hole(Φ2.0mm)
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Paste insulation protective film
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Print solder resist ink
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Plating metal protective film on pads,it's protect pads,and convenient in SMT
-
Print Comp Symbols and logos on board
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Ensure electrical function, avoid open/short circuit
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Paste Stiffener(PI/FR4/AL/SUS) and tape
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Cutting the profile of board
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Final Quality Control For Product
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Surface Mount Technology
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To test the product function, ensure that they meet use requirement
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Protection products, to avoid damage in transit