Auspi Enterprises, The Pioneer of Industrial Revolution

Bare PCB

Layer count	1 ~ 64layers
Laminates type	FR-4(High Tg, Halogen Free, High Frequency) FR-5, CEM-3, PTFE, BT, Getek, Aluminium base，Copper base，KB, Nanya, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon
Board thickness	6-240mil
Max Base copper weight	210um (6oz) for inner layer 210um (6oz) for outer layer
Min mechanical drill size	0.2mm (0.008")
Aspect ratio	12 : 1
Max panel size	Sigle side or double sides:500mm*1200mm, Multilayer layers:508mm X 610mm (20" X 24")
Min line width/space	0.076mm / 0.0.076mm (0.003" / 0.003")
Via hole type	Blind / Burried / Plugged(VOP,VIP…)
HDI / Microvia	YES
Surface finish	HASL Lead Free HASL Immersion Gold (ENIG), Immersion Tin, Immersion Silver Organic Solderability Preservative (OSP) / ENTEK Flash Gold(Hard Gold plating) ENEPIG Selective Gold Plating, Gold thickness up to 3um(120u") Gold Finger, Carbon Print, Peelable S/M
Solder mask color	Green, Blue, White, Black, Clear, etc.
Impedance	Single trace,differential , coplanar impedance controlled ±10%
Outline finish type	CNC Routing; V-Scoring / Cut; Punch
Tolerances	Min Hole tolerance (NPTH) Min Hole tolerance (PTH) Min Pattern tolerance	±0.05mm ±0.075mm ±0.05mm

Sort	Item	Normal capability	Specific capability
Layer count	Rigid-flex PCB	2 ～14	2 ～24
	Flex PCB	1 ～10	1 ～12
Board	Min. Thickness	0.08 +/- 0.03mm	0.05 +/- 0.03mm
	Max. Thickness	6mm	8mm
	Max. Size	485mm * 1000mm	485mm * 1500mm
Hole & Slot	Min.Hole	0.15mm	0.05mm
	Min.Slot Hole	0.6mm	0.5mm
	Aspect Ratio	10 : 1	12 : 1
Trace	Min.Width / Space	0.05 / 0.05mm	0.025 / 0.025mm
Tolerance	Trace W / S	± 0.03mm (W/S≥0.3mm:±10%)	± 0.02mm (W/S≥0.2mm:±10%)
	Hole to hole	± 0.075mm	± 0.05mm
	Hole Dimension	± 0.075mm	± 0.05mm
	Impedance	0 ≤ Value ≤ 50Ω : ± 5Ω 50Ω ≤ Value : ± 10%Ω
Material	Basefilm Specification	PI : 3mil 2mil 1mil 0.8mil 0.5mil
		ED&RA Cu : 2OZ 1OZ 1 / 2OZ 1 / 3OZ 1 / 4OZ
	Basefilm Main supplier	Shengyi / Taiflex / Dupont / Doosan / Thinflex
	Coverlay Specification	PI : 2mil 1mil 0.5mil
	LPI Color	Green / Yellow / White / Black / Blue / Red
	PI Stiffener	T : 25um ～250um
	FR4 Stiffener	T : 100um ～2000um
	SUS Stiffener	T : 100um ～400um
	AL Stiffener	T : 100um ～1600um
	Tape	3M / Tesa / Nitto
	EMI shielding	Silver film / Copper / Silver ink
Surface finish	OSP	0.1 - 0.3um
	HASL	Sn : 5um - 40um
	HASL(Leed free)	Sn : 5um - 40um
	ENEPIG	Ni : 1.0 - 6.0um Ba : 0.015-0.10um Au : 0.015 - 0.10um
	Plating hard gold	Ni : 1.0 - 6.0um Au : 0.02um - 1um
	Flash gold	Ni : 1.0 - 6.0um Au : 0.02um - 0.1um
	ENIG	Ni : 1.0 - 6.0um Au : 0.015um - 0.10um
	Immesion silver	Ag : 0.1 - 0.3um
	Plating Tin	Sn : 5um - 35um
SMT	Type	0.3mm pitch Connectors
		0.4mm pitch BGA / QFP / QFN
		0201 Component

LAMINATE SHEAR
INNERLAYER IMAGE
I/L ETCHING
AOI INSPECTION
LAMINATION
DRILLING
P.T.H.
PANEL PLATING
OUTERLAYER IMAGE
PATTERN PLATING
O/L ETCHING
INSPECTION
LIQUID S/M
SCREEN LEGEND
Immersion gold
FINAL SHAPING
ELECTRICAL TEST
VISUAL INSPECTION
O.Q.C
PACKING&SHIPPING

Auto material cutting machine, cut sheet size 37*49inch, 41*49inch, 43*49inch to working PNL size.
Check point:
1.Base Material Type
2.Dimension
3.No Dent、No Scratch
4.Quantity
After development, the non-product copper is etched away.
Check point:
1.Temperature
2.Speed、Pressure
3.Concentration
4.Line width/space
After development, the non-product copper is etched away.
Check point:
1.Temperature
2.Speed、Pressure
3.Concentration
4.Line width/space
AOI(Automatic Optic Inspection)
Check point:
1.Open/short
2.Copper Residue
Horizontal black oxidation
Check point:
1.Concentration
2.Temperature
3.Coating Thinkness
Mechanical drilling
Check point:
1.Hole Size
2.Hole Wall Roughness
3.Registration
4.The amount of holes
5.Appearance
Plate through holes
Check point:
1.Temperature
2.Concentration
3.Plating Rate
Spry coating line
Check point:
1.No Exposure copper
2.No Mask on Pad
3.No Scratch, Scum
The non-product copper is etched away.
Check point:
1.Temperature
2.Speed
3.Pressure
3.Concentration
4.Line width/space
Pattern plating
Check point:
1.Temperature
2.Concentration
3.Current Density
4.Check scratching the tin on the lines
The non-product copper is etched away.
Check point:
1.Temperature
2.Speed
3.Pressure
3.Concentration
4.Line width/space
AOI(Automatic Optic Inspection)
Check point:
1.Open/short
2.Copper Residue
Spry coating line
Check point:
1.No Exposure copper
2.No Mask on Pad
3.No Scratch, Scum
Auto-printing
Check point:
1.correct CAM data
2.Registration
3.Definition
4.No scratching
Immersion Gold
Check point:
1.Temperature
2.Concentration
CNC routing for finish board size
Check point:
1.Dimension
2.No Powder Residue
3.No Scratch
Flying probe tester
Check point:
1.Open
2.Short
3.Circumferential Separation
Fanal quality control, visual inspection
Check point:
1.Scratching
2.Crease 3.Oxidation
4.Solder deviation
5.Drill deviation
6.Conductor nick
7.Copper residue and so on
SIR Oven
Surface insulation resistance testing
Thermal cycling chamber
Thermal cycling testing
3D Dimension
X-ray measuring instrument Measuing gold thickness, nickel thickenss, solder thickness and so on